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07019
Aluminum nitride (AlN)
Aluminium nitride (AlN) ceramics have high thermal conductivity, high resistance, low dielectric loss, low expansion and good mechanical properties, and can be used as high-performance thermal conductive substrates and ceramic packaging materials.
The rapid development of China's aerospace industry has prompted the development of ultra-large-scale integrated circuits and electronic devices for spacecraft in the direction of high-density, high-frequency, high-power, high-reliability, miniaturisation and multi-functionality. The heat flow density of the devices has increased, and the heat dissipation problem has gradually come to the fore. Heat dissipation material is the key to affect the device heat transfer performance and reliability. Therefore, high thermal conductivity electrical insulating materials have become a breakthrough in the highly integrated and miniaturised electronic systems, in which electronic ceramics have become an important direction to solve the heat dissipation problem. Among the traditional electronic ceramic materials, Al2O3 ceramics have low thermal conductivity and are limited to low and medium power applications, and their coefficients of linear expansion are not exactly matched with Si. High purity BeO ceramics have outstanding thermal conductivity at room temperature, but they are highly toxic and costly to prepare. AlN ceramics are characterised by high thermal conductivity, high electrical resistance, low dielectric loss, low expansion, excellent thermal shock resistance and good mechanical properties, and can be used as a new generation of ideal "high-performance", "structurally-integrated" thermal conductive insulators. It can be used as a new generation of ideal "high-performance", "structure-integrated" thermally conductive insulating materials.
 | Aluminum Nitride Tube Applications |
-Heat-resistant punching and heat exchange materials -Heat-resistant materials - Microwave attenuation materials AlN ceramic materials have broad application prospects and broad potential markets in the electronic field, electric power, locomotive, aviation and aerospace, national defense and military industry, communication, and many industrial fields. |
| Properties of Aluminum Nitride (AlN) |
|
Materail Properties
| Item | Data | Unit |
| Color | Grey | - |
| Density | 3.30 | g/cm3 |
| Surface roughness Ra | 0.01~0.7 | um |
| Bending Strength | 450 | MPa |
| Moh's hardness | 8 | - |
| Thermal conductivity | 180 | 25°C，W/(m·k) |
| Coefficient of Thermal Expansion | 4 | 10-6/°C，100°C |
| Dielectric Constant | 8.8 | 1MHz |
| Dielectric loss | ＜3 | 1MHz，10-4 |
| Electrical Resistivity | >1014 | 25°C，Ω.cm |
| Dielectric strength | 17 | KV/mm |
Aluminum nitride (AlN)
Aluminium nitride (AlN) ceramics have high thermal conductivity, high resistance, low dielectric loss, low expansion and good mechanical properties, and can be used as high-performance thermal conductive substrates and ceramic packaging materials.
The rapid development of China's aerospace industry has prompted the development of ultra-large-scale integrated circuits and electronic devices for spacecraft in the direction of high-density, high-frequency, high-power, high-reliability, miniaturisation and multi-functionality. The heat flow density of the devices has increased, and the heat dissipation problem has gradually come to the fore. Heat dissipation material is the key to affect the device heat transfer performance and reliability. Therefore, high thermal conductivity electrical insulating materials have become a breakthrough in the highly integrated and miniaturised electronic systems, in which electronic ceramics have become an important direction to solve the heat dissipation problem. Among the traditional electronic ceramic materials, Al2O3 ceramics have low thermal conductivity and are limited to low and medium power applications, and their coefficients of linear expansion are not exactly matched with Si. High purity BeO ceramics have outstanding thermal conductivity at room temperature, but they are highly toxic and costly to prepare. AlN ceramics are characterised by high thermal conductivity, high electrical resistance, low dielectric loss, low expansion, excellent thermal shock resistance and good mechanical properties, and can be used as a new generation of ideal "high-performance", "structurally-integrated" thermal conductive insulators. It can be used as a new generation of ideal "high-performance", "structure-integrated" thermally conductive insulating materials.
| Aluminum Nitride Tube Applications |
-Heat-resistant punching and heat exchange materials -Heat-resistant materials - Microwave attenuation materials AlN ceramic materials have broad application prospects and broad potential markets in the electronic field, electric power, locomotive, aviation and aerospace, national defense and military industry, communication, and many industrial fields. |
| Properties of Aluminum Nitride (AlN) |
|
Materail Properties
| Item | Data | Unit |
| Color | Grey | - |
| Density | 3.30 | g/cm3 |
| Surface roughness Ra | 0.01~0.7 | um |
| Bending Strength | 450 | MPa |
| Moh's hardness | 8 | - |
| Thermal conductivity | 180 | 25°C，W/(m·k) |
| Coefficient of Thermal Expansion | 4 | 10-6/°C，100°C |
| Dielectric Constant | 8.8 | 1MHz |
| Dielectric loss | ＜3 | 1MHz，10-4 |
| Electrical Resistivity | >1014 | 25°C，Ω.cm |
| Dielectric strength | 17 | KV/mm |
