End effectors for The Semiconductor Industry

Ceramic arm wafers are commonly used in the semiconductor industry for the fabrication of integrated circuitsand other electronic components. These wafers provide a stable and electrically insulating substrate for the deposition of various materials and layers used in semiconductor manufacturing processes. The ceramic material used in these wafers is typically highly pure and has excellent thermal and mechanical properties, making it ideal for use in high-temperature and high-performance applications. Additionally, ceramic arm wafers are also used in the production of MEMS (microelectromechanical systems) devices, sensors, and other advanced electronic components.

Ceramic Arm Industry Applications

Semiconductor Manufacturing: Ceramic arms play a key role in the semiconductor manufacturing process, often used to handle high-value materials such as silicon wafers to ensure process precision and stability. Machining industry: In high-precision processes, ceramic arms are used as cutting tools to ensure product precision and quality. Medical devices: Ceramic arms are widely used in surgical robots and other medical devices, where their high precision and biocompatibility make them an ideal choice. Chemical industry: Due to its excellent corrosion resistance, ceramic arms are widely used in the chemical industry, especially in environments with corrosive media.

1. Properties of Alumina Ceramic

   Property	Item	95% Al2O3	99% Al2O3	99.8%Al2O3	Unit
   Mechanical Characteristics	Color	White	light yellow	Ivory
   	Bulk Density	3.7	3.85	3.93	g/cm 3
   	Water Absorption	0	0	0	%
   	Bending Strength	300	310	370	MPa
   	Compressive Trength	2,300	2,400	2500	MPa
   	Elastic Modulus	320	340	390	GPa
   	Fracture Toughness	3~4	3~4	4	MPa m 1/2
   	Weber Coefficient	12	12	12	m
   	Vickers Hardness	1,400	1,600	1850	HV 0.5
   Thermal Characterics	Coefficient of Line Thermal Expansion	7~8	7~8	7~8	10 -6 K -1
   	Thermal Conductivity	20	29	32	W/mK
   	Thermal Shock Resistance (Put in Water)	250	200	280	ΔT °C
   	Max Working Temperature	1,500	1,600	1700	°C
   Electrical Characteristics	Volume Resistance At 20°C	>10 14	>10 14	>10 14	Ωcm
   	Dielectric Strength	15×10 6	15×10 6	15×10 6	V/m
   	Dielectric Constant	9	10	10	εr
   	One MHZ Dielectric Loss Angle at 20°C	0.0004	0.0002	0.0001	tanδ
   Chemical Characteristics	Nitric Acid (60%) 90°C	0.1	0.1	0.05	24H WT Loss mg/cm 2
   	Sulphuric Acid (95%) 95°C	0.3	0.34	0.22
   	Caustic Soda (30%) 80°C	0.9	0.95	0.04